Via E. Fermi, 5 — Zona Industriale, Acquaviva Picena (AP)
debora.m@dgmelettronica.it Mon–Fri 8:00–17:30
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Via E. Fermi, 5 — Zona Industriale
63075 Acquaviva Picena (AP), Italy
Mon–Fri 8:00–13:00 / 13:30–17:30

Production facilities

Production departments

The production cycle runs through seven in-house departments, which each board passes through from receipt of the printed circuit board to packaging.

SMT line in operation
01SMT department

Surface-mount assembly

The SMT department is the heart of our production. The line performs automated placement of surface-mount components using the placement data supplied with the design.

The cycle has three stages: solder paste printing on the pads through a stencil made for the board, automatic placement of the components, and reflow in an oven with a thermal profile set for the type of assembly.

Technology
Surface mount (SMD)
Paste printing
Dedicated stencil for each board
Reflow
Oven with a defined thermal profile
Volumes
From prototypes to recurring production
Machine for axial through-hole componentsMachine for radial through-hole components

Axial components — leads running along the axis of the body: resistors, diodes, inductors. They are cut and bent to the board pitch and inserted lying flat.

Radial components — parallel leads on the same side of the body: electrolytic capacitors, LEDs, filters. They are inserted upright on the board.

02PTH department

Through-hole assembly

In PTH (Pin Through Hole) technology the component leads pass through the printed circuit board and are soldered on the opposite side. It is a mature technology, older than surface mounting, which we continue to cover with a dedicated department.

Through-hole meets two different needs. The first is technical: many components — transformers, relays, power connectors, large electrolytic capacitors, terminal blocks — are not available in surface-mount versions or do not offer the same mechanical strength. The second is economic: on low-density boards or in small batches, PTH assembly often reduces the overall production cost compared with an all-SMD solution.

In the department the components are prepared by cutting and bending the leads to the board pitch, then inserted into the holes according to the bill of materials supplied. The boards then move on to the soldering department.

Technology
Through-hole (PTH / THT)
Preparation
Lead cutting and bending
Typical components
Connectors, transformers, relays, electrolytics
Equipment
Dedicated machines for axial and radial components
Benefits
Mechanical strength, power handling, reparability
Automatic soldering machine for through-hole components
03Machine soldering

Automated soldering of through-hole components

After insertion, through-hole components are soldered by machine. This is the stage that turns a mechanical assembly into a reliable electrical connection and ensures consistent results across every unit in the batch.

The soldering machines work both on all-PTH boards and on mixed boards, where the surface-mount components have already been placed and reflowed in the SMT department.

Process
Machine soldering with controlled settings
Board types
PTH and mixed SMT + PTH
Benefit
Repeatability across the whole production batch
Alternative
Hand soldering for special operations
04Manual processes

Manual assembly

The manual department is staffed by trained operators and handles non-standard components, small batches and every operation that cannot be automated or for which automation is not cost-effective.

The work includes inserting special components, making wiring and cable harnesses, fitting heat sinks, brackets and mechanical parts, and assembling the finished product when the order goes beyond the board itself.

Manual insertion
Special and non-standard components
Wiring
Cable harnesses, crimping, internal connections
Assembly
Mechanical and finished-product assembly
Reference
Drawings and bills of materials supplied by the customer
05Quality control

Visual inspection of every board

Quality control is carried out by trained staff who visually inspect the boards at the end of production. The inspection covers solder joint quality, presence and orientation of components, correspondence with the bill of materials and the absence of optically detectable defects.

The work calls for product-specific experience: inspectors know the recurring weak points of each board and can spot an anomaly before it becomes a non-conformity at the customer's site.

Method
Visual inspection by an operator
Coverage
Every board produced
What is checked
Solder joints, polarity, presence and position
Standard
IPC-A-610 acceptability criteria
06Testing area

Functional testing of the assembled product

In the testing area the boards are powered up and verified according to the procedure agreed with the customer in the quotation. No unit is delivered without passing the required functional test.

Test equipment varies with the product. If the customer has its own test benches or procedures, we work to those specifications; otherwise the test method is defined together.

Type
Functional testing of the board
Procedure
Agreed with the customer
Equipment
The customer's own or defined together
Outcome
Non-conforming units set aside and reported
Packaging and shipping preparation area
07Packaging and logistics

Packaging and shipment preparation

Boards are packed in anti-static material, protected against impact and prepared as agreed: individually, in groups, in trays or already kitted for the customer's assembly line.

The same area houses the warehouse for incoming materials and finished products awaiting shipment, with every goods-in and goods-out movement recorded.

Protection
Anti-static material (ESD)
Packaging
To the customer's specification
Warehouse
Incoming materials and finished products
Shipping
Within the lead time agreed for the order

Feasibility assessment

Send us the technical documentation and we will check whether your product is compatible with our processes.